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Wax-bonding 3D microfluidic chips
Gong, Xiuqing2; Yi, Xin2; Xiao, Kang3; Li, Shunbo2; Kodzius, Rimantas4; Qin, Jianhua1; Wen, Weijia2,4; Weijia Wen
刊名LAB ON A CHIP
2010
DOI10.1039/c004744a
10期:19页:2622-2627
收录类别SCI
文章类型Article
部门归属18
项目归属1807
产权排名4;6
WOS标题词Science & Technology ; Life Sciences & Biomedicine ; Physical Sciences
类目[WOS]Biochemical Research Methods ; Chemistry, Multidisciplinary ; Nanoscience & Nanotechnology
研究领域[WOS]Biochemistry & Molecular Biology ; Chemistry ; Science & Technology - Other Topics
关键词[WOS]PAPER-BASED MICROFLUIDICS ; ELECTROPORATION CHIP ; LOW-COST ; DEVICES ; FABRICATION ; SYSTEMS ; POLY(DIMETHYLSILOXANE) ; CELLS ; VISUALIZATION ; PDMS
英文摘要We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes. The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.
语种英语
原文出处查看原文
WOS记录号WOS:000281614900021
引用统计
被引频次:45[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://cas-ir.dicp.ac.cn/handle/321008/103441
专题中国科学院大连化学物理研究所
通讯作者Weijia Wen
作者单位1.Chinese Acad Sci, Dalian Inst Chem Phys, Beijing 11603, Peoples R China
2.Hong Kong Univ Sci & Technol, Dept Phys, Kowloon, Hong Kong, Peoples R China
3.Hong Kong Univ Sci & Technol, Dept Biol, Kowloon, Hong Kong, Peoples R China
4.Hong Kong Univ Sci & Technol, KAUST HKUST Micro Nanofluid Joint Lab, Kowloon, Hong Kong, Peoples R China
推荐引用方式
GB/T 7714
Gong, Xiuqing,Yi, Xin,Xiao, Kang,et al. Wax-bonding 3D microfluidic chips[J]. LAB ON A CHIP,2010,10(19):2622-2627.
APA Gong, Xiuqing.,Yi, Xin.,Xiao, Kang.,Li, Shunbo.,Kodzius, Rimantas.,...&Weijia Wen.(2010).Wax-bonding 3D microfluidic chips.LAB ON A CHIP,10(19),2622-2627.
MLA Gong, Xiuqing,et al."Wax-bonding 3D microfluidic chips".LAB ON A CHIP 10.19(2010):2622-2627.
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